The Next Computing Revolution May Come From Stacking Chips Like Skyscrapers

Researchers may have unlocked the future of computing by turning flat silicon chips into densely stacked 3D architectures.
Morning Overview on MSN

A new 3D silicon-stacking method hit yields of 98 to 100%

Researchers at the University of Illinois Urbana-Champaign have demonstrated a method for stacking silicon transistors in ...
IEEE

Design and Implementation of 2×2 Array Antenna for 5G and Ground-Based Navigation Applications

Abstract: Modern communication demands antennas with ultra-wide bandwidth, high peak gain, and compact size for enhanced performance across a broad frequency spectrum. This study presents a novel 2x2 ...
IEEE

LLAMA: Efficient graph analytics using Large Multiversioned Arrays

Abstract: We present LLAMA, a graph storage and analysis system that supports mutability and out-of-memory execution. LLAMA performs comparably to immutable main-memory analysis systems for graphs ...